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  1. 161

    The Changing Epistemic Governance of European Education The Fabrication of the Homo Academicus Europeanus? by Normand, Romuald

    Cham : Springer International Publishing : Imprint: Springer, 2016
    Format: Electronic eBook
    Full text (Wentworth users only)
  2. 162

    Les Variétés Végétales Tolérantes Aux Herbicides : Un Outil de désherbage Durable ?. by Collectif

    Versailles : Quae, 2014
    Table of Contents: “…expertise et questions posées à lâ€?Inra et au CNRS""; ""Quelques définitions préliminaires""; ""Méthodes et portée de lâ€?…”
    Format: Electronic eBook
    Full text (Emerson users only)
  3. 163

    BIOMASS IN THE BIOECONOMY focus on the eu and us. by Wertz, Jean-Luc

    [Place of publication not identified] : CRC PRESS, 2022
    Format: Electronic eBook
    Full text (WIT users only)
  4. 164

    Rethinking Asian Capitalism The Achievements and Challenges of Vietnam Under Doi Moi

    Cham : Springer International Publishing : Imprint: Palgrave Macmillan, 2022
    1st ed. 2022.
    Format: Electronic eBook
    Full text (Wentworth users only)
  5. 165

    Les Variétés Végétales Tolérantes Aux Herbicides Un Outil de désherbage Durable ?. by Collectif

    Versailles : Quae, 2014
    Table of Contents: “…expertise et questions posées à lâ€?Inra et au CNRS""; ""Quelques définitions préliminaires""; ""Méthodes et portée de lâ€?…”
    Format: Electronic eBook
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  6. 166

    Human thermal comfort by Parsons, K. C. (Kenneth C.), 1953-

    Boca Raton, FL : CRC Press/Taylor & Francis Group, 2020
    Format: Electronic eBook
    Full text (WIT users only)
  7. 167

    A Companion to the anthropology of India

    Malden, MA : Wiley-Blackwell, 2011
    Format: Electronic eBook
    Full text (Wentworth users only)
  8. 168

    Dependability benchmarking for computer systems

    [Los Alamitos, CA] : Hoboken, N.J. : IEEE Computer Society ; Wiley, 2008
    Format: Electronic eBook
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  9. 169

    Quantum Magnetism by Barbara, Bernard

    Dordrecht : Springer Netherlands, 2008
    Format: Electronic eBook
    Full text (Wentworth users only).
  10. 170

    Human cold stress by Parsons, K. C. (Kenneth C.), 1953-

    Boca Raton : CRC Press, 2021
    First edition.
    Format: Electronic eBook
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  11. 171

    The elemental analysis of glass beads technology, chronology and exchange.

    [S.l.] : LEUVEN UNIVERSITY PRESS, 2022
    Format: Electronic eBook
    Full text (Open Access)
  12. 172
  13. 173
  14. 174

    Graphs and Combinatorial Optimization: from Theory to Applications CTW2020 Proceedings

    Cham : Springer International Publishing : Imprint: Springer, 2021
    1st ed. 2021.
    Format: Electronic eBook
    Full text (Wentworth users only)
  15. 175
  16. 176

    Adaptive Systems in Control and Signal Processing 1983 : proceedings of the IFAC workshop, San Francisco, USA, 20-22 June, 1983

    Oxford [Oxfordshire] ; New York : Published for the International Federation of Automatic Control by Pergamon Press, 1984
    1st ed.
    Format: Electronic Conference Proceeding eBook
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  17. 177

    Vertebrate skeletal histology and paleohistology

    Boca Raton, FL : CRC Press, Taylor & Francis Group, 2021
    First editon.
    Format: Electronic eBook
    Full text (WIT users only)
  18. 178

    Polylactic acid-based nanocellulose and cellulose composites

    Boca Raton, FL : CRC Press, 2022
    First edition.
    Format: Electronic eBook
    Full text (WIT users only)
  19. 179

    Colonial culture in France since the revolution

    Bloomington : Indiana University Press, 2014
    Format: Electronic eBook
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  20. 180

    Handbook of 3D integration : technology and applications of 3D integrated circuits

    Weinheim : Wiley-VCH, 2008
    Table of Contents: “…Handbook of 3D Integration; Contents; Preface; List of Contributors; 1 Introduction to 3D Integration; 1.1 Introduction; 1.2 Historical Evolution of Stacked Wafer Concepts; 1.3 3D Packaging vs 3D Integration; 1.4 Non-TSV 3D Stacking Technologies; 1.4.1 Irvine Sensors; 1.4.2 UTCS (Ultrathin Chip Stacking) IMEC, CNRS, U. Barcelona; 1.4.3 Fujitsu; 1.4.4 Fraunhofer/IZM; 1.4.5 3D Plus/Leti; 1.4.6 Toshiba System Block Module; References; 2 Drivers for 3D Integration; 2.1 Introduction; 2.2 Electrical Performance; 2.2.1 Signal Seed; 2.2.2 Memory Latency; 2.3 Power Consumption and Noise; 2.3.1 Noise…”
    Format: Electronic eBook
    Full text (Wentworth users only)